Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints
نویسندگان
چکیده
منابع مشابه
Copper/solder intermetallic growth studies.
Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...
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Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...
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This study presents an electrical current testing that is based on the SnxAg0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn3Ag0.5Cu (SAC305) alloy presented a continuou...
متن کاملControl of Formation of Intermetallic Compound in Dissimilar Joints Aluminum-steel
The elimination of the FexAly type phases was considered the solution to low ductility presented in aluminum-steel welded joints. Recently, the researches do not seek the suppression but the control of the thickness of these compounds. In this work, Al-Fe joints were manufactured by solid state and fusion welding, looking for controlling the formation of intermetallic comp...
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ژورنال
عنوان ژورنال: International Journal of Precision Engineering and Manufacturing-Green Technology
سال: 2019
ISSN: 2288-6206,2198-0810
DOI: 10.1007/s40684-019-00028-1